{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9811122","patent":{"patent_number":"US-9811122","title":"Package on packages and mobile computing devices having the same","assignee":null,"inventors":[],"filing_date":"2015-12-01T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["G06F","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A package on package may include: a first printed circuit board (PCB); a bottom package which includes a first chip die and a second chip die attached to the first PCB; a top package which includes a second PCB and a third chip die attached to the second PCB, and is overlaid over the bottom package; and/or first stack connection solder balls and second stack connection solder balls which are electrically connected between the first PCB and the second PCB, and are formed only around two sides facing each other among sides of the bottom package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package on packages and mobile computing devices having the same","description":"A package on package may include: a first printed circuit board (PCB); a bottom package which includes a first chip die and a second chip die attached to the first PCB; a top package which includes a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9811122","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9811122","citation_suggestion":"Patentable. \"Package on packages and mobile computing devices having the same\" (US-9811122). https://patentable.app/patents/US-9811122","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9811122","json":"https://patentable.app/api/llm-context/US-9811122","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:19:52.432Z"}