{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9812339","patent":{"patent_number":"US-9812339","title":"Method of assembling semiconductor devices of varying thicknesses","assignee":null,"inventors":[],"filing_date":"2017-04-24T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A method of packaging a semiconductor die includes the steps of mounting the semiconductor die on a carrier, electrically connecting electrical contact pads of the semiconductor die to external electrical contacts, and encapsulating the die with a mold compound to form a packaged die. The packaged die is then thinned by using a dicing saw blade to trim the mold compound off of the top, non-active side of the package using a series of vertical cuts. This thinning step can be performed at the same time as a normal dicing step so no additional equipment or process steps are needed. Further, packages of varying thicknesses can be assembled simultaneously."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of assembling semiconductor devices of varying thicknesses","description":"A method of packaging a semiconductor die includes the steps of mounting the semiconductor die on a carrier, electrically connecting electrical contact pads of the semiconductor die to external electr","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9812339","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9812339","citation_suggestion":"Patentable. \"Method of assembling semiconductor devices of varying thicknesses\" (US-9812339). https://patentable.app/patents/US-9812339","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9812339","json":"https://patentable.app/api/llm-context/US-9812339","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:39:32.174Z"}