{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9812348","patent":{"patent_number":"US-9812348","title":"Member peeling method, member processing method, and method for manufacturing semiconductor chip","assignee":null,"inventors":[],"filing_date":"2014-12-15T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A member peeling method includes a step for preparing a first member having a first main face and an outer edge thereof and a second member having a second main face and an outer edge thereon, a step for disposing a photothermal conversion layer on at least one portion of the outer edge on the first main face, a step for mutually joining the first main face and the second main face via an adhesive layer, a step for irradiating a laser light to the photothermal conversion layer, and a step for at least partially peeling the first member from the second member by applying a force to an outer peripheral portion of either of the first member or the second member in a direction away from the other member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Member peeling method, member processing method, and method for manufacturing semiconductor chip","description":"A member peeling method includes a step for preparing a first member having a first main face and an outer edge thereof and a second member having a second main face and an outer edge thereon, a step ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9812348","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9812348","citation_suggestion":"Patentable. \"Member peeling method, member processing method, and method for manufacturing semiconductor chip\" (US-9812348). https://patentable.app/patents/US-9812348","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9812348","json":"https://patentable.app/api/llm-context/US-9812348","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:17:43.570Z"}