{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9812362","patent":{"patent_number":"US-9812362","title":"Wafer processing method","assignee":null,"inventors":[],"filing_date":"2017-03-06T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"Disclosed herein is a wafer processing method including a cover plate providing step of providing a cover plate on the front side of a wafer to thereby form a composite wafer, a welding step of applying a laser beam along each division line formed on the front side of the wafer in the condition where the focal point of the laser beam is set at the interface between the wafer and the cover plate on opposite sides of the lateral center of each division line, thereby forming two parallel welded lines for joining the wafer and the cover plate along each division line, and a dividing step of forming a cut line between the two parallel welded lines formed along each division line, thereby cutting the composite wafer along each division line to obtain individual device chips each covered with the cover plate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing method","description":"Disclosed herein is a wafer processing method including a cover plate providing step of providing a cover plate on the front side of a wafer to thereby form a composite wafer, a welding step of applyi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9812362","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9812362","citation_suggestion":"Patentable. \"Wafer processing method\" (US-9812362). https://patentable.app/patents/US-9812362","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9812362","json":"https://patentable.app/api/llm-context/US-9812362","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:18:06.938Z"}