{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9812373","patent":{"patent_number":"US-9812373","title":"Semiconductor package with top side cooling heat sink thermal pathway","assignee":null,"inventors":[],"filing_date":"2015-12-07T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the semiconductor chip, the encapsulation body completely covering a second main face and four side faces of the semiconductor chip, wherein a first main face of the semiconductor chip that is opposite the first main face is exposed from the encapsulation body, a heat spreader attached to the semiconductor package, the heat spreader completely covering the first main face of the semiconductor chip, and an electrically insulating layer disposed on the heat spreader remote from the semiconductor package. The electrically insulating layer is completely separated from the semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package with top side cooling heat sink thermal pathway","description":"An electronic module includes a semiconductor package including a semiconductor chip and an electrically insulating encapsulation body encapsulating the semiconductor chip, the encapsulation body comp","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9812373","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9812373","citation_suggestion":"Patentable. \"Semiconductor package with top side cooling heat sink thermal pathway\" (US-9812373). https://patentable.app/patents/US-9812373","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9812373","json":"https://patentable.app/api/llm-context/US-9812373","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:42:09.055Z"}