{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9812379","patent":{"patent_number":"US-9812379","title":"Semiconductor package and manufacturing method","assignee":null,"inventors":[],"filing_date":"2016-10-19T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A semiconductor package includes a die comprising at least a via and a least a hot via; a ground lead, formed directly under a back side of the die, contacting with the back side of the die, and directly connected to the a least a hot via and the at least a via of the die; a buffer layer, formed on the die, configured to absorb a stress applied to the die and prevent the die from damage; and a molding portion, formed on the die buffer layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method","description":"A semiconductor package includes a die comprising at least a via and a least a hot via; a ground lead, formed directly under a back side of the die, contacting with the back side of the die, and direc","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9812379","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9812379","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method\" (US-9812379). https://patentable.app/patents/US-9812379","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9812379","json":"https://patentable.app/api/llm-context/US-9812379","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:48:11.985Z"}