{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9812414","patent":{"patent_number":"US-9812414","title":"Chip package and a manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2016-06-17T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A chip package includes a first substrate; a first insulation layer disposed over the first substrate; a conductive structure disposed within the first insulation layer; a buffering member embedded into the first insulation layer; a redistribution layer (RDL) electrically connected with the conductive structure and disposed over the conductive structure and the buffering member; and a second insulation layer disposed over the RDL, wherein a portion of the RDL is exposed from the second insulation layer and disposed over the buffering member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package and a manufacturing method thereof","description":"A chip package includes a first substrate; a first insulation layer disposed over the first substrate; a conductive structure disposed within the first insulation layer; a buffering member embedded in","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9812414","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9812414","citation_suggestion":"Patentable. \"Chip package and a manufacturing method thereof\" (US-9812414). https://patentable.app/patents/US-9812414","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9812414","json":"https://patentable.app/api/llm-context/US-9812414","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:50:10.919Z"}