{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9812430","patent":{"patent_number":"US-9812430","title":"Package on-package method","assignee":null,"inventors":[],"filing_date":"2016-10-24T00:00:00.000Z","publication_date":"2017-11-07T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method comprises forming a trench over a top surface of a metal structure of a bottom package, dispersing an epoxy flux material in the trench, mounting a top package on the bottom package, wherein a solder ball of the top package is in direct contact with the top surface of the metal structure and performing a reflow process to form a joint structure, wherein the joint structure comprises the solder ball of the top package coupled to the metal structure in the bottom package and an epoxy protection layer having a first edge in direct contact with a top surface of the bottom package and a second edge surrounding a lower portion of the solder ball."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package on-package method","description":"A method comprises forming a trench over a top surface of a metal structure of a bottom package, dispersing an epoxy flux material in the trench, mounting a top package on the bottom package, wherein ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9812430","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9812430","citation_suggestion":"Patentable. \"Package on-package method\" (US-9812430). https://patentable.app/patents/US-9812430","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9812430","json":"https://patentable.app/api/llm-context/US-9812430","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:55:37.244Z"}