{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9817079","patent":{"patent_number":"US-9817079","title":"Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet","assignee":null,"inventors":[],"filing_date":"2014-07-21T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":11,"abstract":"A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet","description":"A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9817079","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9817079","citation_suggestion":"Patentable. \"Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet\" (US-9817079). https://patentable.app/patents/US-9817079","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9817079","json":"https://patentable.app/api/llm-context/US-9817079","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:17:51.156Z"}