{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818611","patent":{"patent_number":"US-9818611","title":"Methods of forming etch masks for sub-resolution substrate patterning","assignee":null,"inventors":[],"filing_date":"2016-09-20T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Techniques disclosed herein provide a method for pitch reduction (increasing pitch/feature density) for creating high-resolution features and also for cutting on pitch of sub-resolution features. Techniques include using multiple materials having different etch characteristics to selectively etch features and create cuts where specified. A sequence of materials or repeating pattern of lines of materials is used that provides selective self-alignment based on different etch resistivities. Combined with an underlying transfer or memorization layer, multiple different etch selectivities can be accessed. An etch mask defines which regions of the lines of multiple materials can be etched."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of forming etch masks for sub-resolution substrate patterning","description":"Techniques disclosed herein provide a method for pitch reduction (increasing pitch/feature density) for creating high-resolution features and also for cutting on pitch of sub-resolution features. Tech","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818611","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818611","citation_suggestion":"Patentable. \"Methods of forming etch masks for sub-resolution substrate patterning\" (US-9818611). https://patentable.app/patents/US-9818611","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818611","json":"https://patentable.app/api/llm-context/US-9818611","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:40:47.674Z"}