{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818644","patent":{"patent_number":"US-9818644","title":"Interconnect structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2016-04-01T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"The present disclosure provides an interconnect structure, including a substrate, a first conductive feature over the substrate, a second conductive feature over the first conductive feature, and a dielectric layer surrounding the first conductive feature and the second conductive feature. A width of the first conductive feature and a width of the second conductive feature are between 10 nm and 50 nm. The present disclosure also provides a method for manufacturing an interconnect structure, including (1) forming a via opening and a line trench in a dielectric layer, (2) forming a 1-dimensional conductive feature in the via opening, (3) forming a conformal catalyst layer over a sidewall of the line trench, a bottom of the line trench, and a top of the 1-dimensional conductive feature, and (4) removing the conformal catalyst layer from the bottom of the line trench and the top of the 1-dimensional conductive feature."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structure and manufacturing method thereof","description":"The present disclosure provides an interconnect structure, including a substrate, a first conductive feature over the substrate, a second conductive feature over the first conductive feature, and a di","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818644","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818644","citation_suggestion":"Patentable. \"Interconnect structure and manufacturing method thereof\" (US-9818644). https://patentable.app/patents/US-9818644","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818644","json":"https://patentable.app/api/llm-context/US-9818644","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:35:39.366Z"}