{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818659","patent":{"patent_number":"US-9818659","title":"Multi-die package comprising unit specific alignment and unit specific routing","assignee":null,"inventors":[],"filing_date":"2016-10-11T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of making a semiconductor device can include forming an embedded die panel by encapsulating a first semiconductor die and a second semiconductor die with conductive interconnects in a single step. An actual position of the first semiconductor die and second semiconductor die can be measured within the embedded die panel. The first semiconductor die and the second semiconductor die can be interconnected by a build-up interconnect structure comprising a first unit specific alignment portion aligned with the first semiconductor die, a second unit specific alignment portion aligned with the second semiconductor die, unit specific routing connecting the first unit specific alignment portion and the second unit specific alignment portion, and a fixed portion aligned with outline of embedded die panel and coupled to the unit specific routing."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-die package comprising unit specific alignment and unit specific routing","description":"A method of making a semiconductor device can include forming an embedded die panel by encapsulating a first semiconductor die and a second semiconductor die with conductive interconnects in a single ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818659","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818659","citation_suggestion":"Patentable. \"Multi-die package comprising unit specific alignment and unit specific routing\" (US-9818659). https://patentable.app/patents/US-9818659","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818659","json":"https://patentable.app/api/llm-context/US-9818659","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:26:25.318Z"}