{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818665","patent":{"patent_number":"US-9818665","title":"Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces","assignee":null,"inventors":[],"filing_date":"2014-02-28T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","B33Y","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":4,"abstract":"In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces","description":"In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending betwe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818665","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818665","citation_suggestion":"Patentable. \"Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces\" (US-9818665). https://patentable.app/patents/US-9818665","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818665","json":"https://patentable.app/api/llm-context/US-9818665","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:00:30.670Z"}