{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818668","patent":{"patent_number":"US-9818668","title":"Thermal vias disposed in a substrate without a liner layer","assignee":null,"inventors":[],"filing_date":"2016-03-10T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method relating generally to a substrate is disclosed. In such a method, the substrate has formed therein a plurality of vias. A liner layer is located on the substrate, including being located in a subset of the plurality of vias. At least one of the plurality of vias does not have the liner layer located therein. A thermally conductive material is disposed in the at least one of the plurality of vias to provide a thermal via structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Thermal vias disposed in a substrate without a liner layer","description":"A method relating generally to a substrate is disclosed. In such a method, the substrate has formed therein a plurality of vias. A liner layer is located on the substrate, including being located in a","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818668","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818668","citation_suggestion":"Patentable. \"Thermal vias disposed in a substrate without a liner layer\" (US-9818668). https://patentable.app/patents/US-9818668","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818668","json":"https://patentable.app/api/llm-context/US-9818668","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:01:39.690Z"}