{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818671","patent":{"patent_number":"US-9818671","title":"Liquid-cooled heat sink for electronic devices","assignee":null,"inventors":[],"filing_date":"2015-02-10T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","G06F","H01L","G06F","H01L","H01L"],"num_claims":2,"abstract":"A heat sink includes a heat absorption module, a liquid transport module and a heat exchange module. The transport module includes one inlet and outlet tubes, each having a first end connected spatially with the heat absorption module. The heat exchange module includes a fin assembly, one fan unit and several connection passages extending through the fin assembly. One end portion of the fin assembly defines a liquid storage chamber, which is divided into several first chambers therein such that first ends of the connection passages extend respectively into the first chambers. The other end portion of the fin assembly defines two second chambers such that second ends of the connection passages extend respectively into the second chambers while a second end of each inlet and outlet tubes is connected spatially with a first and second pump units, which are in spatially communicated with the first chambers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Liquid-cooled heat sink for electronic devices","description":"A heat sink includes a heat absorption module, a liquid transport module and a heat exchange module. The transport module includes one inlet and outlet tubes, each having a first end connected spatial","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818671","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818671","citation_suggestion":"Patentable. \"Liquid-cooled heat sink for electronic devices\" (US-9818671). https://patentable.app/patents/US-9818671","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818671","json":"https://patentable.app/api/llm-context/US-9818671","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:16:20.474Z"}