{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818677","patent":{"patent_number":"US-9818677","title":"Semiconductor component having group III nitride semiconductor device mounted on substrate and interconnected to lead frame","assignee":null,"inventors":[],"filing_date":"2016-07-06T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"In accordance with an embodiment, a semiconductor component is provided that includes a leadframe having a device receiving area, one or more leadframe leads and at least one insulated metal substrate bonded to a first portion of the device receiving area. A first semiconductor device is mounted to a first insulated metal substrate, the first semiconductor device configured from a III-N semiconductor material. A first electrical interconnect is coupled between the first current carrying terminal of the first semiconductor device and a second portion of the die receiving area. In accordance with another embodiment, method includes providing a first semiconductor chip comprising a III-N semiconductor substrate material and a second semiconductor chip comprising a silicon based semiconductor substrate. The first semiconductor chip is mounted on a first substrate and the second semiconductor chip on a second substrate. The first semiconductor chip is electrically coupled to the second semiconductor chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor component having group III nitride semiconductor device mounted on substrate and interconnected to lead frame","description":"In accordance with an embodiment, a semiconductor component is provided that includes a leadframe having a device receiving area, one or more leadframe leads and at least one insulated metal substrate","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818677","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818677","citation_suggestion":"Patentable. \"Semiconductor component having group III nitride semiconductor device mounted on substrate and interconnected to lead frame\" (US-9818677). https://patentable.app/patents/US-9818677","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818677","json":"https://patentable.app/api/llm-context/US-9818677","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:17:13.332Z"}