{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818683","patent":{"patent_number":"US-9818683","title":"Electronic package and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2015-08-04T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A met of fabricating an electronic package is provided, including: providing a carrier body haying a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic structure that has a plurality of conductive elements received in the recessed portions correspondingly; and removing a portion of the carrier body, with the conductive elements exposed from the second surface of the carrier body. Therefore, the carrier body is retained, and the fabrication cost is reduced since no temporary material is required. The present invention further provides the electronic package thus fabricated."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package and method of fabricating the same","description":"A met of fabricating an electronic package is provided, including: providing a carrier body haying a first surface formed with a plurality of recessed portions, and a second surface opposing the first","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818683","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818683","citation_suggestion":"Patentable. \"Electronic package and method of fabricating the same\" (US-9818683). https://patentable.app/patents/US-9818683","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818683","json":"https://patentable.app/api/llm-context/US-9818683","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:15:45.686Z"}