{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818698","patent":{"patent_number":"US-9818698","title":"EMI package and method for making same","assignee":null,"inventors":[],"filing_date":"2014-10-08T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"EMI package and method for making same","description":"An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818698","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818698","citation_suggestion":"Patentable. \"EMI package and method for making same\" (US-9818698). https://patentable.app/patents/US-9818698","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818698","json":"https://patentable.app/api/llm-context/US-9818698","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:21:45.069Z"}