{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818699","patent":{"patent_number":"US-9818699","title":"Semiconductor packages and methods of fabricating the same","assignee":null,"inventors":[],"filing_date":"2016-03-09T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Provided is a method of fabricating a semiconductor package. The method includes providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chips; forming a first shielding layer on the mold layer; cutting the mold layer and the first shielding layer to form trenches between the semiconductor chips; and forming a second shielding layer to fill the trenches."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages and methods of fabricating the same","description":"Provided is a method of fabricating a semiconductor package. The method includes providing a substrate including a plurality of semiconductor chips; forming a mold layer covering the semiconductor chi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818699","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818699","citation_suggestion":"Patentable. \"Semiconductor packages and methods of fabricating the same\" (US-9818699). https://patentable.app/patents/US-9818699","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818699","json":"https://patentable.app/api/llm-context/US-9818699","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:00:57.352Z"}