{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818700","patent":{"patent_number":"US-9818700","title":"Stress relief structures in package assemblies","assignee":null,"inventors":[],"filing_date":"2016-03-07T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package structure includes a substrate; and a die region having a plurality of dies disposed on the substrate. A first die of the plurality of dies is larger than a second die of the plurality of dies. The semiconductor package structure further includes a plurality of stress relief structures on the substrate. At least one stress relief structure of the plurality of stress relief structures is at a corner of the substrate. Each stress relief structure is spaced from a closest die of the plurality of dies by a first distance. Upper surfaces of each stress relief structure of the plurality of stress relief structures are unconnected."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stress relief structures in package assemblies","description":"A semiconductor package structure includes a substrate; and a die region having a plurality of dies disposed on the substrate. A first die of the plurality of dies is larger than a second die of the p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818700","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818700","citation_suggestion":"Patentable. \"Stress relief structures in package assemblies\" (US-9818700). https://patentable.app/patents/US-9818700","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818700","json":"https://patentable.app/api/llm-context/US-9818700","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:18:39.218Z"}