{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818720","patent":{"patent_number":"US-9818720","title":"Structure and formation method for chip package","assignee":null,"inventors":[],"filing_date":"2015-12-28T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Structures and formation methods of a chip package are provided. The chip package includes a first chip structure and a second chip structure. Heights of the first chip structure and the second chip structure are different. The chip package also includes a package layer covering sidewalls of the first chip structure and sidewalls of the second chip structure. Top surfaces of the first chip structure and the second chip structure are not covered by the package layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Structure and formation method for chip package","description":"Structures and formation methods of a chip package are provided. The chip package includes a first chip structure and a second chip structure. Heights of the first chip structure and the second chip s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818720","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818720","citation_suggestion":"Patentable. \"Structure and formation method for chip package\" (US-9818720). https://patentable.app/patents/US-9818720","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818720","json":"https://patentable.app/api/llm-context/US-9818720","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:48:28.045Z"}