{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818722","patent":{"patent_number":"US-9818722","title":"Package structure and method for manufacturing thereof","assignee":null,"inventors":[],"filing_date":"2016-08-05T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package structure includes a package, at least one first molding material, and at least one second semiconductor device. The package includes at least one first semiconductor device therein. The package has a top surface. The first molding material is present on the top surface of the package and has at least one opening therein, in which at least a region of the top surface of the package is exposed by the opening of the first molding material. The second semiconductor device is present on the top surface of the package and is molded in the first molding material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structure and method for manufacturing thereof","description":"A package structure includes a package, at least one first molding material, and at least one second semiconductor device. The package includes at least one first semiconductor device therein. The pac","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818722","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818722","citation_suggestion":"Patentable. \"Package structure and method for manufacturing thereof\" (US-9818722). https://patentable.app/patents/US-9818722","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818722","json":"https://patentable.app/api/llm-context/US-9818722","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:28:08.562Z"}