{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9818723","patent":{"patent_number":"US-9818723","title":"Multi-chip package with interconnects extending through logic chip","assignee":null,"inventors":[],"filing_date":"2017-01-19T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A microelectronic package includes a first microelectronic element comprising logic circuitry which is flip-chip mounted to a substrate, the substrate having terminals for connection with a circuit panel or other external component. A second microelectronic element overlies a rear surface of the first microelectronic element and has contacts electrically coupled with the substrate through electrically conductive interconnects extending through a region of the first microelectronic element. A heat spreader is thermally coupled with the rear surface of the substrate, either directly or through an additional element overlying the rear surface. Additional contacts of the second microelectronic element may be coupled with contacts of the substrate through electrically conductive structure disposed beyond an edge surface of the first microelectronic element."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multi-chip package with interconnects extending through logic chip","description":"A microelectronic package includes a first microelectronic element comprising logic circuitry which is flip-chip mounted to a substrate, the substrate having terminals for connection with a circuit pa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9818723","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9818723","citation_suggestion":"Patentable. \"Multi-chip package with interconnects extending through logic chip\" (US-9818723). https://patentable.app/patents/US-9818723","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9818723","json":"https://patentable.app/api/llm-context/US-9818723","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:21:36.840Z"}