{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9820400","patent":{"patent_number":"US-9820400","title":"Package and method for fabricating package","assignee":null,"inventors":[],"filing_date":"2015-06-01T00:00:00.000Z","publication_date":"2017-11-14T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A package that hermetically seals an integrated circuit includes a metal lid (7) and a metal housing (10) having an open upper portion (12). In the package, the housing (10) includes in a wall surface thereof a glass unit (2) that seals a plurality of lead terminals therein. The glass unit (2) is disposed in a wall surface of the housing (10) such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit (2) is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit (2) and metal that forms the wall surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package and method for fabricating package","description":"A package that hermetically seals an integrated circuit includes a metal lid (7) and a metal housing (10) having an open upper portion (12). In the package, the housing (10) includes in a wall surface","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9820400","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9820400","citation_suggestion":"Patentable. \"Package and method for fabricating package\" (US-9820400). https://patentable.app/patents/US-9820400","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9820400","json":"https://patentable.app/api/llm-context/US-9820400","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:23:10.576Z"}