{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9822452","patent":{"patent_number":"US-9822452","title":"Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus","assignee":null,"inventors":[],"filing_date":"2015-02-06T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":20,"abstract":"A conduction structure includes a device substrate (third substrate) including a conductive portion, an IC (second substrate) including an upper surface, an end surface inclined toward the upper surface, and a conductive portion (second conductive portion), a sealing plate (first substrate) including an upper surface, an end surface (first side wall portion) inclined toward the upper surface, and a conductive portion (first conductive portion), and plating layers that respectively form electrical connections between a conductive portion and a conductive portion and between a conductive portion and the conductive portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus","description":"A conduction structure includes a device substrate (third substrate) including a conductive portion, an IC (second substrate) including an upper surface, an end surface inclined toward the upper surfa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9822452","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9822452","citation_suggestion":"Patentable. \"Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus\" (US-9822452). https://patentable.app/patents/US-9822452","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9822452","json":"https://patentable.app/api/llm-context/US-9822452","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:24:36.751Z"}