{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824880","patent":{"patent_number":"US-9824880","title":"Method of polishing silicon wafer and method of producing epitaxial wafer","assignee":null,"inventors":[],"filing_date":"2014-03-13T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A method of polishing a silicon wafer, including performing a mirror polishing process on the silicon wafer, the mirror polishing process including: performing rough polishing on the silicon wafer; subsequently removing metallic impurities attached on a surface of the silicon wafer by performing both an oxidation process with ozone gas or ozone water and an oxide-film removing process with hydrofluoric acid vapor or hydrofluoric acid solution on the surface of the silicon wafer; and then performing final polishing. The invention provides a method of polishing a silicon wafer and a method of producing an epitaxial wafer that can prevent the occurrence of PID in the silicon wafer due to a mirror-polishing process and the degradation of surface quality of the silicon wafer after the mirror-polishing process and the epitaxial wafer having an epitaxial layer stacked thereon in a subsequent process."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of polishing silicon wafer and method of producing epitaxial wafer","description":"A method of polishing a silicon wafer, including performing a mirror polishing process on the silicon wafer, the mirror polishing process including: performing rough polishing on the silicon wafer; su","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824880","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824880","citation_suggestion":"Patentable. \"Method of polishing silicon wafer and method of producing epitaxial wafer\" (US-9824880). https://patentable.app/patents/US-9824880","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824880","json":"https://patentable.app/api/llm-context/US-9824880","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:01:15.972Z"}