{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824902","patent":{"patent_number":"US-9824902","title":"Integrated fan-out package and method of fabricating the same","assignee":null,"inventors":[],"filing_date":"2016-07-12T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"An integrated fan-out package including a chip module, a second integrated circuit, a second insulating encapsulation, and a redistribution circuit structure is provided. The chip module includes a first insulating encapsulation and a first integrated circuit embedded in the first insulating encapsulation, and the first integrated circuit includes a first surface and first conductive terminals on the first surface. The second integrated circuit includes a second surface and second conductive terminals on the second surface. The chip module and the second integrated circuit are embedded in the second insulating encapsulation. The first and second conductive terminals are accessibly exposed from the first and second insulating encapsulation. The redistribution circuit structure covers the first surface, the second surfaces, the first insulating encapsulation, and the second insulating encapsulation. The redistribution circuit structure is electrically connected to the first and second conductive terminals. Methods of fabricating the integrated fan-out package are also provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated fan-out package and method of fabricating the same","description":"An integrated fan-out package including a chip module, a second integrated circuit, a second insulating encapsulation, and a redistribution circuit structure is provided. The chip module includes a fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824902","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824902","citation_suggestion":"Patentable. \"Integrated fan-out package and method of fabricating the same\" (US-9824902). https://patentable.app/patents/US-9824902","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824902","json":"https://patentable.app/api/llm-context/US-9824902","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:49:48.186Z"}