{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824926","patent":{"patent_number":"US-9824926","title":"Wafer processing method","assignee":null,"inventors":[],"filing_date":"2017-04-24T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":1,"abstract":"A wafer is transferred to a holding surface of a chuck table by using a transfer unit having a suction pad. The front side of the wafer is held under suction through a protective tape on the holding surface, and the suction pad is removed from the back side of the wafer. A modified layer is formed on the back side of the wafer along division lines. The wafer is transferred by mounting the wafer held by the suction pad on the holding surface and sandwiching the wafer between the suction pad and the holding surface of the chuck table. A suction force is applied to the holding surface of the chuck table to thereby hold the front side of the wafer through the protective tape on the holding surface of the chuck table under suction, and the suction pad is then removed from the back side of the wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer processing method","description":"A wafer is transferred to a holding surface of a chuck table by using a transfer unit having a suction pad. The front side of the wafer is held under suction through a protective tape on the holding s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824926","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824926","citation_suggestion":"Patentable. \"Wafer processing method\" (US-9824926). https://patentable.app/patents/US-9824926","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824926","json":"https://patentable.app/api/llm-context/US-9824926","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:29:22.789Z"}