{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824939","patent":{"patent_number":"US-9824939","title":"Semiconductor assembly and method to form the same","assignee":null,"inventors":[],"filing_date":"2016-03-30T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A semiconductor device having a composite pad including a primary portion and a subsidiary portion is disclosed. The primary portion is provided for electrical connection to an internal circuit of the semiconductor device. The subsidiary portion is provided for probing, in particular, for testing high frequency performance of the semiconductor device by probing with a RF-probe. Because the subsidiary portion is independent from the primary portion, the subsidiary portion does not affect the electrical performance of the semiconductor device. Also, the subsidiary portion has a narrowed contact area with respect to the RF-probe to lessen adherence of metal flakes from the pad onto the probe."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor assembly and method to form the same","description":"A semiconductor device having a composite pad including a primary portion and a subsidiary portion is disclosed. The primary portion is provided for electrical connection to an internal circuit of the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824939","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824939","citation_suggestion":"Patentable. \"Semiconductor assembly and method to form the same\" (US-9824939). https://patentable.app/patents/US-9824939","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824939","json":"https://patentable.app/api/llm-context/US-9824939","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:03:00.473Z"}