{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824954","patent":{"patent_number":"US-9824954","title":"Semiconductor package comprising stacked integrated circuit chips having connection terminals and through electrodes symmetrically arranged","assignee":null,"inventors":[],"filing_date":"2014-05-05T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","G11C","G11C","H01L","H01L","H01L","H01L","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"An integrated circuit device comprises N stacked first integrated circuit chips each of which includes a first circuit and N stacked second integrated circuit chips each of which includes a second circuit. The N stacked second integrated circuit chips are stacked on the N stacked first integrated circuit chips. A first and second integrated circuit chips at symmetric positions with respect to a reference surface are paired. Each of the first and second integrated circuit chips include connection terminals for connecting the first circuit of the first integrated circuit chip and the second circuit of the second integrated circuit chip in the pair, and through electrodes each penetrating an inside of the chip. The connection terminals and through electrodes are arranged to be symmetric with respect to the reference surface."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package comprising stacked integrated circuit chips having connection terminals and through electrodes symmetrically arranged","description":"An integrated circuit device comprises N stacked first integrated circuit chips each of which includes a first circuit and N stacked second integrated circuit chips each of which includes a second cir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824954","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824954","citation_suggestion":"Patentable. \"Semiconductor package comprising stacked integrated circuit chips having connection terminals and through electrodes symmetrically arranged\" (US-9824954). https://patentable.app/patents/US-9824954","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824954","json":"https://patentable.app/api/llm-context/US-9824954","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:49:33.898Z"}