{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824962","patent":{"patent_number":"US-9824962","title":"Local dense patch for board assembly utilizing laser structuring metallization process","assignee":null,"inventors":[],"filing_date":"2016-09-29T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":24,"abstract":"Methods of forming microelectronic package structures are described. Those methods/structures may include forming a high density region on a board comprising a first plurality of conductive structures disposed on a dielectric material on the board, wherein the first plurality of conductive structures comprises a first pitch between individual ones of the first plurality of conductive structures. A low density region on the board comprises a second plurality of conductive structures disposed on the dielectric material, wherein the second plurality of conductive structures comprises a second pitch between individual ones of the second plurality of conductive structures, wherein the second pitch is more than about twice the magnitude of the first pitch."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Local dense patch for board assembly utilizing laser structuring metallization process","description":"Methods of forming microelectronic package structures are described. Those methods/structures may include forming a high density region on a board comprising a first plurality of conductive structures","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824962","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824962","citation_suggestion":"Patentable. \"Local dense patch for board assembly utilizing laser structuring metallization process\" (US-9824962). https://patentable.app/patents/US-9824962","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824962","json":"https://patentable.app/api/llm-context/US-9824962","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:10:19.518Z"}