{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824963","patent":{"patent_number":"US-9824963","title":"Wiring board, and semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-12-13T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A wiring board includes: a core substrate including: a metal plate having first through holes; a first insulating layer covering an upper surface and a lower surface of the metal plate and inner wall surfaces of the first through holes; through electrodes penetrating the first insulating layer in a thickness direction and each having an upper end surface; a first wiring layer formed on a lower surface of the first insulating layer and connected to the through electrodes; a wiring structure formed on an upper surface of the first insulating layer; and an outermost insulating layer formed on a lower surface of the core substrate. A wiring density of the wiring structure is higher than that of the core substrate. The metal plate is located at a side of the wiring structure with respect to a center of the first insulating layer in a thickness direction thereof."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring board, and semiconductor device","description":"A wiring board includes: a core substrate including: a metal plate having first through holes; a first insulating layer covering an upper surface and a lower surface of the metal plate and inner wall ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824963","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824963","citation_suggestion":"Patentable. \"Wiring board, and semiconductor device\" (US-9824963). https://patentable.app/patents/US-9824963","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824963","json":"https://patentable.app/api/llm-context/US-9824963","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:47:45.864Z"}