{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824979","patent":{"patent_number":"US-9824979","title":"Electronic package having electromagnetic interference shielding and associated method","assignee":null,"inventors":[],"filing_date":"2015-12-29T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An electronic package includes a substrate having opposing first and second surfaces. Conductive areas are on a first surface of the substrate and include at least one edge conductive area. A plurality of conductive bumps are on the second surface of the substrate and coupled to respective ones of the conductive areas. An integrated circuit (IC) is carried by the substrate. Bond wires are coupled between the IC and respective ones of the conductive areas. An encapsulating material is over the IC and adjacent portions of the substrate. A conductive layer is on the encapsulating material, and at least one conductive body is coupled between the at least one edge conductive area and the conductive layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package having electromagnetic interference shielding and associated method","description":"An electronic package includes a substrate having opposing first and second surfaces. Conductive areas are on a first surface of the substrate and include at least one edge conductive area. A pluralit","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824979","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824979","citation_suggestion":"Patentable. \"Electronic package having electromagnetic interference shielding and associated method\" (US-9824979). https://patentable.app/patents/US-9824979","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824979","json":"https://patentable.app/api/llm-context/US-9824979","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:03:31.240Z"}