{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824992","patent":{"patent_number":"US-9824992","title":"Bump structure having a side recess and semiconductor structure including the same","assignee":null,"inventors":[],"filing_date":"2016-11-16T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"In some embodiments, the present disclosure relates to a semiconductor structure. The semiconductor structure may have a first conductive structure and a second conductive structure arranged over a first substrate. A bump structure is arranged between the first conductive structure and a second substrate. A solder layer is configured to electrically couple the first conductive structure and the bump structure. The bump structure has a recess that is configured to reduce a protrusion of the solder layer in a direction extending from the first conductive structure to the second conductive structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bump structure having a side recess and semiconductor structure including the same","description":"In some embodiments, the present disclosure relates to a semiconductor structure. The semiconductor structure may have a first conductive structure and a second conductive structure arranged over a fi","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824992","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824992","citation_suggestion":"Patentable. \"Bump structure having a side recess and semiconductor structure including the same\" (US-9824992). https://patentable.app/patents/US-9824992","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824992","json":"https://patentable.app/api/llm-context/US-9824992","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:03:32.685Z"}