{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9824997","patent":{"patent_number":"US-9824997","title":"Die package with low electromagnetic interference interconnection","assignee":null,"inventors":[],"filing_date":"2014-07-02T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die have a first lead with a first metal core, a dielectric layer surrounding the first metal core, and first outer metal layer connected to ground; and a second lead with a second metal core, and a second dielectric layer surrounding the second metal core, and a second outer metal layer connected to ground. Each lead reducing susceptibility to EMI and crosstalk."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Die package with low electromagnetic interference interconnection","description":"A die package having lead structures connecting to a die that provide for electromagnetic interference reductions. Mixed impedance leads connected to the die have a first lead with a first metal core,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9824997","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9824997","citation_suggestion":"Patentable. \"Die package with low electromagnetic interference interconnection\" (US-9824997). https://patentable.app/patents/US-9824997","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9824997","json":"https://patentable.app/api/llm-context/US-9824997","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:06:48.261Z"}