{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9825007","patent":{"patent_number":"US-9825007","title":"Chip package structure with molding layer and method for forming the same","assignee":null,"inventors":[],"filing_date":"2016-07-13T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A chip package structure is provided. The chip package structure includes a first chip, a second chip, and a third chip. The second chip is between the first chip and the third chip. The chip package structure includes a first molding layer surrounding the first chip. The chip package structure includes a second molding layer surrounding the second chip. The chip package structure includes a third molding layer surrounding the third chip, the first molding layer, and the second molding layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package structure with molding layer and method for forming the same","description":"A chip package structure is provided. The chip package structure includes a first chip, a second chip, and a third chip. The second chip is between the first chip and the third chip. The chip package ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9825007","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9825007","citation_suggestion":"Patentable. \"Chip package structure with molding layer and method for forming the same\" (US-9825007). https://patentable.app/patents/US-9825007","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9825007","json":"https://patentable.app/api/llm-context/US-9825007","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:06:39.116Z"}