{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9826630","patent":{"patent_number":"US-9826630","title":"Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof","assignee":null,"inventors":[],"filing_date":"2014-09-04T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Fan-Out Wafer Level Packages (FO-WLPs) and methods for fabricating FO-WLPs having Embedded Ground Plane (EGP) connections are provided. In one embodiment, the method includes forming a molded panel around an EGP array from which a plurality of preformed EGP connections project. One or more Redistribution Layers (RDLs) are produced over the molded panel. The molded panel is then singulated to yield a plurality of FO-WLPs each including a molded package body containing an EGP from the EGP array and one or more of preformed EGP connections."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof","description":"Fan-Out Wafer Level Packages (FO-WLPs) and methods for fabricating FO-WLPs having Embedded Ground Plane (EGP) connections are provided. In one embodiment, the method includes forming a molded panel ar","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9826630","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9826630","citation_suggestion":"Patentable. \"Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof\" (US-9826630). https://patentable.app/patents/US-9826630","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9826630","json":"https://patentable.app/api/llm-context/US-9826630","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:30:57.551Z"}