{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9826632","patent":{"patent_number":"US-9826632","title":"Substrate structure and the process manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-04-06T00:00:00.000Z","publication_date":"2017-11-21T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A multi-layer substrate structure to achieve multiple arrangements of power/ground domains is disclosed. The multi-layer substrate structure comprises a first layer for disposing an integrated circuit thereon and a second layer coupled to the first layer, wherein a connection structure is electrically connected to a plurality of power/ground domains on the second layer. With different combinations of the sawing lines and keep-out regions on the multi-layer substrate structure for cutting off some portions of the connection structure, the invention can achieve multiple arrangements of power/ground domains without impacting the customer's PCB or system board design so as to cut short the cycle time for engineering development phase."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate structure and the process manufacturing the same","description":"A multi-layer substrate structure to achieve multiple arrangements of power/ground domains is disclosed. The multi-layer substrate structure comprises a first layer for disposing an integrated circuit","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9826632","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9826632","citation_suggestion":"Patentable. \"Substrate structure and the process manufacturing the same\" (US-9826632). https://patentable.app/patents/US-9826632","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9826632","json":"https://patentable.app/api/llm-context/US-9826632","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:36:48.914Z"}