{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831129","patent":{"patent_number":"US-9831129","title":"Semiconductor device manufacturing method","assignee":null,"inventors":[],"filing_date":"2017-01-26T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"A semiconductor device manufacturing method which improves working efficiency. The method includes the step of transporting by air a package as a sealed moisture-proof bag which contains a case housing a semiconductor wafer laminate, in which the semiconductor wafer laminate has a plurality of semiconductor wafers stacked with a protective sheet interposed between semiconductor wafers. In order to facilitate separation of the protective sheet from the semiconductor wafers after unpacking the package, the protective sheet has a plurality of convex parts, a plurality of concave parts, and a flat part between a convex part and a concave part. A hole penetrating the protective sheet is made in each convex part and the center of the hole is located off the apex of the convex part."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device manufacturing method","description":"A semiconductor device manufacturing method which improves working efficiency. The method includes the step of transporting by air a package as a sealed moisture-proof bag which contains a case housin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831129","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831129","citation_suggestion":"Patentable. \"Semiconductor device manufacturing method\" (US-9831129). https://patentable.app/patents/US-9831129","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831129","json":"https://patentable.app/api/llm-context/US-9831129","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:56:27.167Z"}