{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831140","patent":{"patent_number":"US-9831140","title":"Wafer having pad structure","assignee":null,"inventors":[],"filing_date":"2015-07-14T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A wafer including a substrate having a plurality of integrated circuits formed above the substrate, and at least one scribe line between two of the integrated circuits. The wafer further includes a plurality of dielectric layers formed in the at least one scribe line having a process control monitor (PCM) pad structure formed therein, the PCM pad structure having: a plurality of metal pads interconnected by a plurality of conductive vias. The PCM pad further includes a plurality of contact bars in contact with a bottom-most metal pad, the contact bars extending substantially vertically from the bottom-most metal pad into the substrate. Additionally, the PCM pad includes an isolation structure substantially surrounding the plurality of contact bars to isolate the PCM pad structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer having pad structure","description":"A wafer including a substrate having a plurality of integrated circuits formed above the substrate, and at least one scribe line between two of the integrated circuits. The wafer further includes a pl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831140","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831140","citation_suggestion":"Patentable. \"Wafer having pad structure\" (US-9831140). https://patentable.app/patents/US-9831140","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831140","json":"https://patentable.app/api/llm-context/US-9831140","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:47:06.631Z"}