{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831146","patent":{"patent_number":"US-9831146","title":"Molded package","assignee":null,"inventors":[],"filing_date":"2015-06-26T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":7,"abstract":"A molded package includes an IC chip mounted on a first surface of a lead frame, and a molded resin encapsulating the lead frame together with the IC chip. The molded resin has a second surface-side opening portion that is formed to expose a chip correspondence portion of a second surface of the lead frame corresponding to the IC chip. A filler material is filled in the second surface-side opening portion. The filler material has a thermal conductivity equal to or greater than that of the molded resin and is softer than the molded resin. The chip correspondence portion has a rough surface with fine splits so as to increase a contact area with the filler material, and the filler material is in contact with the external member."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Molded package","description":"A molded package includes an IC chip mounted on a first surface of a lead frame, and a molded resin encapsulating the lead frame together with the IC chip. The molded resin has a second surface-side o","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831146","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831146","citation_suggestion":"Patentable. \"Molded package\" (US-9831146). https://patentable.app/patents/US-9831146","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831146","json":"https://patentable.app/api/llm-context/US-9831146","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:34:59.788Z"}