{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831151","patent":{"patent_number":"US-9831151","title":"Heat sink for semiconductor modules","assignee":null,"inventors":[],"filing_date":"2016-08-03T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A thermal interface includes a first thermal interface material (TIM) layer and a lid disposed on the first TIM layer. A second TIM layer is disposed on a surface of the lid opposite the first TIM layer. The second TIM layer is from about 75% to about 25% as wide as a width of the lid in at least one direction. A heat sink disposed on a surface of the second TIM layer opposite the lid."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heat sink for semiconductor modules","description":"A thermal interface includes a first thermal interface material (TIM) layer and a lid disposed on the first TIM layer. A second TIM layer is disposed on a surface of the lid opposite the first TIM lay","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831151","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831151","citation_suggestion":"Patentable. \"Heat sink for semiconductor modules\" (US-9831151). https://patentable.app/patents/US-9831151","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831151","json":"https://patentable.app/api/llm-context/US-9831151","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:35:17.342Z"}