{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831163","patent":{"patent_number":"US-9831163","title":"Circuit substrate and method for manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-02-24T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A circuit substrate includes a core substrate having a cavity, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating resin layer and laminated on a first surface of the core substrate such that the insulating resin layer is covering a first surface of the metal block in the cavity, and a second build-up layer including an insulating resin layer and laminated on a second surface of the core substrate such that the insulating resin layer is covering a second surface of the metal block in the cavity. The second build-up layer includes via conductors connected to the second surface of the metal block and common lands connecting the via conductors in parallel."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Circuit substrate and method for manufacturing the same","description":"A circuit substrate includes a core substrate having a cavity, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating resin layer and laminated ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831163","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831163","citation_suggestion":"Patentable. \"Circuit substrate and method for manufacturing the same\" (US-9831163). https://patentable.app/patents/US-9831163","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831163","json":"https://patentable.app/api/llm-context/US-9831163","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:44:42.163Z"}