{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831167","patent":{"patent_number":"US-9831167","title":"Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2017-08-16T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier board structure. A die is placed in the opening and bonded to the carrier board. A sealant is filled in a gap between surrounding walls of the opening and the die at a height lower than the die to fixedly place the die within the opening and to leave a non-active surface of the die exposed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof","description":"A compound carrier board structure of Flip-Chip Chip-Scale Package and manufacturing method thereof provides a baseplate with an opening bonded to a carrier board in order to form a compound carrier b","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831167","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831167","citation_suggestion":"Patentable. \"Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof\" (US-9831167). https://patentable.app/patents/US-9831167","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831167","json":"https://patentable.app/api/llm-context/US-9831167","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:39:12.721Z"}