{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831181","patent":{"patent_number":"US-9831181","title":"Simultaneous formation of liner and metal conductor","assignee":null,"inventors":[],"filing_date":"2017-02-21T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"An integrated circuit device having a substrate including a dielectric layer is patterned with a set of conductive line trenches. Each conductive line trench has parallel vertical sidewalls and a horizontal bottom. A first metal layer fills a first portion of the set of conductive line trenches. The first metal layer is created by an anneal and reflow process of a first metal. A liner which is an alloy of the first metal and a selected element is formed at interfaces of the metal layer and a surface of the dielectric. The liner is created simultaneously with the metal fill by the anneal and reflow process. A wetting layer is disposed on the first metal layer and fills a second portion of the set of conductive line trenches. A second metal layer is disposed on the wetting layer and fills a remainder portion of the set of conductive line trenches."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Simultaneous formation of liner and metal conductor","description":"An integrated circuit device having a substrate including a dielectric layer is patterned with a set of conductive line trenches. Each conductive line trench has parallel vertical sidewalls and a hori","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831181","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831181","citation_suggestion":"Patentable. \"Simultaneous formation of liner and metal conductor\" (US-9831181). https://patentable.app/patents/US-9831181","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831181","json":"https://patentable.app/api/llm-context/US-9831181","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:43:43.788Z"}