{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831184","patent":{"patent_number":"US-9831184","title":"Buried TSVs used for decaps","assignee":null,"inventors":[],"filing_date":"2013-12-27T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"An interposer having decaps formed in blind-vias, a packaged semiconductor structure having decaps formed in blind-vias, and methods for forming the same are provided. In one embodiment, an interposer is provided that includes an interconnect layer disposed on a substrate. A plurality of through-vias are formed through the substrate in an isolated region of the substrate. At least one of the plurality of conductive vias are electrically coupled to at least one of a plurality of top wires formed in the interconnect layer. A plurality of blind-vias are formed through the substrate in a dense region of the substrate during a common etching step with the through-vias. At least one blind-via includes (a) a dielectric material lining the blind-vias, and (b) a conductive material filling the lined blind-vias and forming a decoupling capacitor."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Buried TSVs used for decaps","description":"An interposer having decaps formed in blind-vias, a packaged semiconductor structure having decaps formed in blind-vias, and methods for forming the same are provided. In one embodiment, an interposer","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831184","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831184","citation_suggestion":"Patentable. \"Buried TSVs used for decaps\" (US-9831184). https://patentable.app/patents/US-9831184","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831184","json":"https://patentable.app/api/llm-context/US-9831184","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:21:39.407Z"}