{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831189","patent":{"patent_number":"US-9831189","title":"Integrated circuit package with a conductive grid formed in a packaging substrate","assignee":null,"inventors":[],"filing_date":"2013-07-09T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"An integrated circuit package includes a packaging substrate, which has an electrically conductive grid formed on a dielectric layer, and an integrated circuit die electrically coupled to the electrically conductive grid at one or more locations. In this embodiment, the electrically conductive grid includes a plurality of electrically conductive portions, wherein each portion is electrically coupled to at least one other portion, and a plurality of void regions that are electrically non-contiguous and substantially free of electrically conductive material. One advantage of the integrated circuit package is that a packaging substrate that is reduced in thickness, and therefore rigidity, can still maintain planarity during operation. The electrically conductive grid formed on a dielectric layer in the packaging substrate can replace a power plane or a ground plane in the packaging substrate, thereby reducing stressed produced as a result of thermal expansion mismatch between materials in the packaging substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package with a conductive grid formed in a packaging substrate","description":"An integrated circuit package includes a packaging substrate, which has an electrically conductive grid formed on a dielectric layer, and an integrated circuit die electrically coupled to the electric","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831189","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831189","citation_suggestion":"Patentable. \"Integrated circuit package with a conductive grid formed in a packaging substrate\" (US-9831189). https://patentable.app/patents/US-9831189","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831189","json":"https://patentable.app/api/llm-context/US-9831189","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:39:27.318Z"}