{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831195","patent":{"patent_number":"US-9831195","title":"Semiconductor package structure and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-10-28T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Various embodiments relate to a semiconductor package structure. The semiconductor package structure includes a first chip having a first surface and a second surface opposite the first surface. The semiconductor package structure further includes a supporter surrounding an edge of the first chip. The semiconductor package structure further includes a conductive layer disposed over the first surface of the first chip and electrically connected to the first chip. The semiconductor package structure further includes an insulation layer disposed over the first surface of the first chip, wherein the insulation layer extends toward and overlaps the supporter in a vertical projection direction. The semiconductor package structure further includes an encapsulant between the first chip and the supporter and surrounding at least the edge of the first chip."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package structure and method of manufacturing the same","description":"Various embodiments relate to a semiconductor package structure. The semiconductor package structure includes a first chip having a first surface and a second surface opposite the first surface. The s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831195","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831195","citation_suggestion":"Patentable. \"Semiconductor package structure and method of manufacturing the same\" (US-9831195). https://patentable.app/patents/US-9831195","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831195","json":"https://patentable.app/api/llm-context/US-9831195","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:32:39.061Z"}