{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831196","patent":{"patent_number":"US-9831196","title":"Methods and apparatus of guard rings for wafer-level-packaging","assignee":null,"inventors":[],"filing_date":"2017-01-30T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of forming a semiconductor device includes forming a passivation layer on top of a guard ring and an active area of a circuit device, forming a passivation contact within the passivation layer, the passivation contact being over and electrically connected to the guard ring, forming a post-passivation interconnect (PPI) guard ring over the passivation layer and electrically connected to the passivation contact, and forming a first polymer layer over the PPI guard ring, the first polymer layer extending along a sidewall of the PPI guard ring."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods and apparatus of guard rings for wafer-level-packaging","description":"A method of forming a semiconductor device includes forming a passivation layer on top of a guard ring and an active area of a circuit device, forming a passivation contact within the passivation laye","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831196","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831196","citation_suggestion":"Patentable. \"Methods and apparatus of guard rings for wafer-level-packaging\" (US-9831196). https://patentable.app/patents/US-9831196","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831196","json":"https://patentable.app/api/llm-context/US-9831196","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:09:15.293Z"}