{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831207","patent":{"patent_number":"US-9831207","title":"No-flow underfill for package with interposer frame","assignee":null,"inventors":[],"filing_date":"2015-01-09T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of forming a package on a package structure includes applying a no-reflow underfill (NUF) layer over a substrate, wherein the substrate has at least one first bump and a plurality of second bumps surrounding the at least one first bump. The method further includes bonding a semiconductor die to the at least one first bump. The method further includes bonding an interposer frame to the plurality of second bumps, wherein the interposer frame surrounds the semiconductor die, wherein the semiconductor die is disposed in an opening of the interposer frame."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"No-flow underfill for package with interposer frame","description":"A method of forming a package on a package structure includes applying a no-reflow underfill (NUF) layer over a substrate, wherein the substrate has at least one first bump and a plurality of second b","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831207","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831207","citation_suggestion":"Patentable. \"No-flow underfill for package with interposer frame\" (US-9831207). https://patentable.app/patents/US-9831207","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831207","json":"https://patentable.app/api/llm-context/US-9831207","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:19:01.452Z"}